Tin Sputtering Targets

MetalsTek Engineering is a trusted manufacturer and supplier of Tin Sputtering Targets. We can provide the targets in various materials, purities, shapes, sizes and prices.

Tin Sputtering Target, Sn

Tin Sputtering Target, Sn

Material: Tin

Purity: 99.9%~99.999%

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Applications: Semiconductor Deposition, CVD, PVD, Optics Coatings

Gold Tin Sputtering Target, Au/Sn

Material: Gold Tin Alloy

Purity: 99.99%

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Applications: Semiconductor Deposition, CVD, PVD, Optics Coatings

Copper Tin Sputtering Target, Cu/Sn

Material: Copper Tin

Purity: 99.99%

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Indium Tin Sputtering Target, In/Sn

Indium Tin Sputtering Target

Material: Tin Indium Alloy

Purity: 99.99%, ≈117°C Melting Point

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Tin Zinc Sputtering Target, Sn/Zn Zn/Sn

Tin Zinc Sputtering Target

Material: Tin Zinc Alloy

Purity: 99.9%~99.999%, Composition Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Manganese Tin Sputtering Target, Mn/Sn

Material: Manganese Tin Alloy

Purity: 99.9%~99.999%, Composition Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Tin Silver Sputtering Target, Sn/Ag

Tin Silver Sputtering Target,

Material: Tin Silver Alloy

Purity: 99.9%~99.999%, Composition Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Antimony Indium Tin Sputtering Target, Sb/In/Sn

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Material: Antimony Indium Tin Alloy

Purity: 99%~99.999%, Composition Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Tin Antimonide Sputtering Target, Sn/Sb

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Material: Antimony Indium Tin

Purity: 99.9%~99.999%,

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Bonding: Indium Recommended

Tin Oxide Sputtering Target, SnO2

Material: Tin Oxide

Purity: 99.9%~99.999%

Properties: Light Yellow, 6.95g/cc Density, ≈1,630°C M.P.

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Bonding: Elastomer Recommended

Tin Sulfide Sputtering Target, SnS SnS2

Tin Sulfide Sputtering Target, SnS SnS2

Material: Tin Sulfide

Purity: 99.9%

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Bonding: Elastomer Recommended

Indium Tin Oxide Sputtering Target, ITO

Indium Tin Oxide Sputtering Target, ITO

Material: Indium Tin Oxide, In2O3/SnO2

Purity: 99.9%~99.99%

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Tin Telluride Sputtering Target, SnTe

Material: Tin Telluride

Purity: 99.9%~99.99%

Properties: 6.5g/cc Density, ≈790°C M.P.

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Tin Fluoride Sputtering Target, SnF2

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Material: Tin Fluoride

Purity: 99.9%

Properties: 4.57g/cc Density, ≈213°C M.P.

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Bonding: Elastomer Recommended

Antimony-Doped Tin Oxide Sputtering Target, ATO

Antimony-Doped Tin Oxide Sputtering Target, ATO

Material: Antimony Doped Tin Oxide

Purity: SnO2:Sb 99.9%~99.99%

Properties: 6.9g/cc Density, ≈1,720°C M.P.

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Bonding: Indium Recommended

Niobium Stannide Sputtering Target, Nb3Sn

Material: Niobium Stannide

Purity: 99.9%~99.999%, 5.7g/cc Density

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Tin Arsenide Sputtering Target, SnAs

Tin Arsenide Sputtering Target, SnAs

Material: Tin Arsenide

Purity: 99.9%~99.999%,

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤14” * Length≤32”

Bonding: Indium Recommended

Description

Tin Sputtering Targets are essential materials used in sputtering, a phenomenon where particles of solid material are ejected from its surface when bombarded by energetic particles. Tin (Sn) Sputtering Targets, composed of the element with atomic number 50, are silvery, lustrous, gray, metallic materials with a thermal conductivity of 66.6 W/m.K and a melting point of 232°C. These targets are utilized in various applications such as soldering, plating, and alloy production like pewter. Tin Sputtering Targets play a crucial role in thin film deposition processes, enabling precise etching, analytical techniques, and the manufacture of optical coatings, semiconductor devices, and nanotechnology products.

Tin (Sn) Specifications

Material Type

Tin

E-Beam

Excellent

Symbol

Sn

Thermal Evaporation Techniques

Boat: Mo

Atomic Weight

118.71

Coil: W

Atomic Number

50

Basket: W

Appearance

Silvery Lustrous Gray, Metallic

Crucible: Al2O3

Thermal Conductivity

66.6 W/m.K

E-Beam Crucible Liner Material

FABMATE®, Tantalum

Melting Point

232 °C

Temp. (°C) for Given Vap. Press. (Torr)

10-8: 682

Coefficient of Thermal Expansion

22 x 10-6/K

10-6: 807

Theoretical Density

7.28 g/cc

10-4: 997

Z Ratio

0.724

Comments

Wets Mo low sputter power. Use Ta liner in E-beam guns. Low Melting Point materials not ideal for sputtering.

Applications of Tin Sputtering Targets

Tin (Sn) and Tin-based Sputtering Targets have a wide range of applications across various industries due to their unique properties. Sputtering targets are materials used in the process of physical vapor deposition (PVD), where atoms or molecules are deposited onto a substrate surface to form a thin film. Here are some common applications of Tin and Tin-based Sputtering Targets:

 

  1. Semiconductor Industry: Tin and tin-based sputtering targets are extensively used in the semiconductor industry for thin film deposition. Tin films are crucial for the fabrication of interconnects, metal gates, and diffusion barriers in integrated circuits (ICs). Additionally, tin-based compounds like tin oxide (SnO2) are utilized in the production of transparent conductive coatings for applications such as touchscreens, solar cells, and flat-panel displays.
  2. Optical Coatings: Tin and tin-based sputtering targets are employed in the deposition of optical coatings. Thin films of tin or tin compounds can be deposited onto glass or plastic substrates to create anti-reflective coatings, which enhance the transmission of light through optical components like lenses, mirrors, and windows. Tin-based coatings also find applications in infrared (IR) reflectors and filters.
  3. Solar Energy: Tin-based sputtering targets are utilized in the production of thin-film solar cells. Tin oxide (SnO2) thin films serve as transparent conductive layers in photovoltaic devices, enabling efficient electron conduction while allowing light transmission. These coatings help improve the performance and durability of solar panels.
  4. Decorative Coatings: Tin and tin-based sputtering targets are used in the decorative coatings industry for applications such as architectural glass, automotive trim, and consumer electronics. Tin coatings can provide a lustrous, corrosion-resistant finish to various substrates, enhancing their aesthetic appeal and durability.
  5. Packaging: Tin coatings are applied to metal substrates through sputtering to provide corrosion protection and improve solderability. Tin-plated steel is commonly used in food packaging, beverage cans, and electronic components due to its excellent barrier properties and compatibility with soldering processes.
  6. Microelectronics: Tin and tin-based sputtering targets are integral to the production of microelectronic devices, including microchips, sensors, and MEMS (micro-electromechanical systems). Tin films serve as conductive layers, diffusion barriers, and bonding interfaces in these miniaturized electronic components.
  7. Thin Film Batteries: Tin-based materials are being explored for use in thin-film battery technologies. Tin films can act as anodes in lithium-ion batteries, offering high energy storage capacity and improved cycling stability compared to traditional graphite anodes.

The versatility and performance of Tin and Tin-based Sputtering Targets make them indispensable in numerous technological applications spanning electronics, optics, energy, and more.

Packaging

Our Tin and Tin-based Sputtering Targets are clearly labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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*e-mail address with your company's domain name is preferred. 

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Attach a Drawing
*e-mail address with your company's domain name is preferred.