Copper Sputtering Targets

MetalsTek Engineering is a worldwide leading manufacturer and supplier of high-purity Copper Evaporation Materials. Our range of products includes copper metals, as well as their alloys, compounds, and other related offerings. The most common evaporation materials shapes are pellets, granules, rod, wire, and starter sources. However, if you need an uncommon shape or size, contact us to see if we can meet your specific requirements.

Copper Sputtering Target, Cu

Copper Sputtering Target

Material: Copper, 99.9%~99.999%

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Custom: Forms, Purities, Sizes, and Prices

Rotatory Copper Sputtering Target, Cu

Rotatory Copper Sputtering Target, Cu

Material: Copper, 99.9%~99.999%

Shape: Planar Targets, Custom-made

Sizes: T≤1/2” * W≤70” * L≤90”, G.W. ≤450lbs/204.5kg

Custom: Forms, Purities, Sizes, and Prices

Copper Oxide Sputtering Target, CuO

Copper_Oxide_Sputtering_Target__CuO-removebg-preview

Material: Copper Oxide, 99.9%~99.99%

Properties: Black, 1,201°C M.P., 6.31 g/cc Density

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Planar Copper Sputtering Target, Cu

Planar Copper Sputtering Target, Cu

Material: Copper, 99.9%~99.999%

Shape: Planar Targets, Custom-made

Sizes: T≤1/2” * W≤70” * L≤90”, G.W. ≤450lbs/204.5kg

Custom: Forms, Purities, Sizes, and Prices

Copper(I) Oxide Sputtering Targets, Cu2O

Copper(I) Oxide Sputtering Targets, Cu2O

Material: Copper Oxide, 99.9%~99.999%

Properties: 1,235°C M.P., 6.0g/cc Density

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Aluminum Copper Sputtering Target, Al/Cu Cu/Al

Aluminum Copper Sputtering Target

Material: Aluminum Copper Alloy, 99.9%~99.999%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Aluminum Silicon Copper Sputtering Target, Al/Si/Cu

Aluminum Silicon Copper Sputtering Target

Material: Aluminum Silicon Copper Alloy, 99.9%~99.99%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Chromium Copper Sputtering Target, Cu/Cr Cr/Cu

Chromium Copper Sputtering Target

Material: Chromium Copper Alloy, 99.9%~99.99%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Cobalt Sputtering Target, Cu/Co Co/Cu

Copper Cobalt Sputtering Target

Material: Copper Cobalt Alloy, 99.9%~99.99%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Gallium Sputtering Target, Cu/Ga

Copper Gallium Sputtering Target

Material: Copper Gallium Alloy, 99.9%~99.999%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Germanium Sputtering Target, Cu/Ge

Copper_Germanium_Sputtering_Target-removebg-preview

Material: Copper Germanium Alloy, 99.9%~99.999%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Indium Sputtering Target, Cu/In

Copper Indium Sputtering Target

Material: Copper Indium Alloy, 99.9%~99.999%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Nickel Sputtering Target, Cu/Ni Ni/Cu

Copper Nickel Sputtering Target

Material: Copper Nickel Alloy, 99.9%~99.999%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Zinc Sputtering Target, Cu/Zn Zn/Cu

Copper Zinc Sputtering Target

Material: Copper Zinc Alloy, 99.9%~99.999%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Other Copper Alloy Sputtering Target

Copper Zinc Sputtering Target

Material: Mn/Cu, Zr/Cu, Cu/Sn, Be/Cu, Ag/Cu, Cu/Mn/Ni

Purity: 99.9%~99.999%, Composition Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Sulfide Sputtering Target, CuS (Cu2S)

Copper Sulfide Sputtering Target

Material: Copper Sulfide, 99.9%~99.95%

Composition: Can be Customized

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Selenide Sputtering Target, CuSe CuSe2

Materials: Copper Selenide

Purity: 99.9%~99.99%

Properties: Black Solid, 550°C M.P., 5.99g/cc Density

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Indium Selenide Sputtering Target, CIS

Materials: Copper Indium Selenide

Purity: 99.9%~99.999%

Properties: Solid, 1,327°C M.P., 5.77g/cc Density

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Copper Indium Gallium Selenide Sputtering Target, CIGS

Materials: Copper Indium Gallium Selenide

Symbol: CuIn1−xGaxSe2 (x = 0~1)

Purity: 99.9%~99.999%

Properties: Silvery, 990~1,070°C M.P., ≈5.7g/cc Density

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Bonding: Indium Bonding Recommended

Other Copper Sputtering Targets

Other Copper Sputtering Targets

Material: Cu/Ga/Se, La2CuMnO6, La2CuO4, Nd2CuO4, SmCuO4, YBCO, CZT, and More

Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sizes: Disc – Dia. 1”~14” * Thick 0.125” / 0.25”

      Block – Thick≥1mm * Width ≤12” * Length≤14”

Other: Varies in Shapes, Sizes, Purities and Prices

Description

Copper Sputtering Targets

Copper (Cu) and its alloys are cornerstone materials in the domain of vacuum evaporation, offering unmatched electrical and thermal conductivity, pivotal to produce electronic, optical, and coating layers. These materials, particularly favored for their efficacy in creating conductive paths, are instrumental in the manufacturing of electronic circuits, semiconductor devices, and solar panels. The adaptability of copper, available in forms such as pellets, granules, and powders, ensures its compatibility with diverse vacuum evaporation setups, catering to a broad spectrum of industrial applications. Copper has a melting point of 1,083°C, a density of 8.92 g/cc, and is a top-quality conductor of heat and electricity.

Expanding beyond elemental copper, copper-based evaporation materials, including various alloys and compounds like copper oxides (CuO and Cu2O), enrich the application landscape. These derivatives not only inherit copper’s excellent conductivity but also introduce properties like enhanced corrosion resistance, mechanical strength, and specific optical characteristics. This versatility makes copper-based materials essential for a wide array of applications, from functional coatings in electronics to decorative finishes in architectural elements, showcasing their critical role in advancing material science and thin film technology.

Copper (Cu) Specifications

Material Type

Copper

Coefficient of Thermal Expansion

16.5 x 10-6/K

Symbol

Cu

Theoretical Density

8.92 g/cc

Atomic Weight

63.546

Z Ratio

0.437

Atomic #

29

Sputter

DC

Appearance

Copper, Metallic

Max Power Density

200 (Watts/Square Inch)

Thermal Conductivity

400 W/m.K

Type of Bond

Indium, Elastomer

Melting Point

1083°C

Comments

Adhesion poor. Use interlayer (Cr). Evaporates using any source material.

Applications of Copper Sputtering Targets

  1. Semiconductor Manufacturing: Copper sputtering targets are utilized in the production of semiconductor devices, including integrated circuits and memory chips, where thin copper films are deposited to create conductive interconnects and wiring layers.
  2. Solar Cell Fabrication: In the renewable energy sector, copper sputtering targets are employed to deposit thin copper films onto photovoltaic cells, facilitating efficient electron conduction and enhancing the overall performance of solar panels.
  3. Display Technology: Copper sputtering targets find application in the manufacturing of flat-panel displays, such as LCDs and OLEDs, where they are used to deposit transparent conductive coatings and electrode layers.
  4. Magnetic Storage Media: In the data storage industry, copper sputtering targets are utilized to produce thin films for magnetic storage media, including hard disk drives and magnetic tapes, enabling high-density data storage with improved reliability and performance.
  5. Decorative Coatings: Copper sputtering targets are employed in decorative applications, such as architectural coatings and automotive trim, to create metallic finishes with superior adhesion, corrosion resistance, and aesthetic appeal.

Packaging

Our Copper Sputtering Targets are clearly labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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*e-mail address with your company's domain name is preferred. 

Request A Quote
Attach a Drawing
*e-mail address with your company's domain name is preferred.