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Target assemblies · Custom engineering
Custom bonding solutions for metal and ceramic sputtering targets, including indium bonding, elastomer bonding, backing plate fabrication, debonding, cleaning, inspection, and rebonding of customer-supplied assemblies.
Bonding · Debonding · Rebonding · Backing plate reuse
Sputtering target and backing plate assembly
High thermal conductivity and a compliant bond layer for a wide range of metal and ceramic sputtering targets.
Flexible bonding for applications requiring accommodation of thermal expansion and mechanical stress.
Remove the used target, clean and inspect the backing plate, and bond a replacement target to qualified reusable backing plates.
Customer-supplied backing plates can be cleaned and inspected for potential reuse before rebonding.
Custom-machined OFHC copper and other backing plates manufactured to customer drawings and sputtering-source requirements.
Complete target manufacturing, backing plate preparation, and bonding supplied as a finished assembly.
Used sputtering target assemblies do not always require a new backing plate. MetalsTek can evaluate customer-supplied assemblies for debonding, cleaning, inspection, and rebonding with a new target.
After the used target and residual bonding material are removed, the backing plate is cleaned and inspected for reuse. Qualified backing plates can then be prepared and bonded to a replacement sputtering target.
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Send your used assembly, drawing, or photos for review. Reuse is subject to inspection; damaged or unsuitable plates may require replacement.
| Consideration | Indium Bonding | Elastomer Bonding |
|---|---|---|
Bond Type | Metallic solder | Flexible elastomer |
Thermal Performance | High thermal conductivity | Application-dependent |
Flexibility | Compliant metallic layer | Flexible polymer layer |
Thermal Expansion Accommodation | Depends on bond and assembly design | Useful for stress-sensitive assemblies |
Typical Use | Metal and ceramic targets | Assemblies requiring stress accommodation |
Selection depends on the target material, geometry, backing plate, operating conditions, and bonding requirements. Send us your specifications for review.
Supply a new backing plate or send your existing assembly for evaluation, bonding, or reuse.
Standard and custom-machined OFHC copper backing plates for sputtering target assemblies, manufactured to drawing where required.
Existing backing plates can be supplied for bonding, debonding, or reuse evaluation. Suitability for reuse is confirmed after inspection.
Custom backing plates manufactured to customer drawings for circular, rectangular, and OEM sputtering-source configurations.
Bonding and rebonding requirements are reviewed according to the target material, backing plate design, assembly geometry, and operating conditions. The images below show existing MetalsTek target assembly and equipment imagery; they are not presented as a before-and-after debonding case.
Bonding requirements are reviewed according to the target material and backing plate configuration.
Target geometry, backing plate condition, and interface requirements are reviewed before final assembly.
Check bonding integrity and coverage according to the applicable assembly requirements.
Verify critical dimensions of the finished target assembly against the agreed drawing or specification.
Evaluate reusable backing plates for surface condition, geometry, and suitability for rebonding.
Inspect the completed assembly before protective packaging and shipment.
Send the information available for your project. Drawings and assembly photos help us review bonding or rebonding feasibility.
Metal and ceramic targets can be reviewed for bonding. Suitability depends on target material, dimensions, backing plate design, and sputtering conditions. Send the assembly requirements for confirmation.
Yes, customer-supplied backing plates can be evaluated for reuse. Cleaning, surface condition, geometry, and the remaining bonding material are reviewed before a plate is approved for rebonding. Reuse is not guaranteed.
MetalsTek can review used assemblies for debonding and rebonding. After removal and cleaning, a qualified backing plate can be prepared and bonded to a replacement target.
Yes. Indium target bonding is available for suitable metal and ceramic target assemblies. The target, backing plate, and operating requirements are reviewed to confirm the appropriate bonding approach.
Yes. Standard or custom-machined OFHC copper backing plates and drawing-based configurations can be reviewed as part of a complete target and backing plate assembly.
Send the target material, target and backing plate dimensions or drawings, quantity, delivery requirements, and the bonding method if specified. For rebonding, include photos of the existing assembly and any relevant sputtering-source information.
Engineering Review
Send us your target specifications, backing plate drawing, or photos of the existing assembly. Our team will review the bonding or rebonding requirements.