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MetalsTek supplies elemental tantalum (Ta) sputtering targets and the related tantalum compound targets listed below. Choose the composition and purity first, then define the target geometry and whether a backing plate or bonded assembly is needed. Exact dimensions, finish, inspection and bonding are reviewed against the drawing and sputtering source.
Ta, TaC, TaN, Ta2O5 and TaSi2 are different target materials; their specifications must be confirmed separately.
How to order: Use the catalog links for listed configurations. Send a drawing through the RFQ form for custom geometry, special purity, backing plates or bonding. Catalog listings do not confirm current stock or source compatibility.
The information below helps engineering and purchasing compare target configurations before requesting a quote.
State the required Ta assay, maximum impurities and any named grade or certificate requirement. The same purity label does not define an identical impurity profile.
Send the target drawing or sputtering-source model. Include diameter or length and width, thickness, tolerance, keeper details and surface-finish requirements.
Specify a standalone target or a bonded assembly. For a bonded target, include backing-plate material and drawing, total thickness, mounting features and any required bonding method.
State the dimensional checks, chemistry or impurity report, surface condition and certificate of analysis needed for acceptance. Requirements are confirmed for the selected configuration.
Material: elemental tantalum (Ta). Existing orderable examples list 99.95% and 99.99% Ta; confirm the required assay, impurity limits and lot documentation for your order.
Geometry: planar discs and rectangles are represented in the listed configurations. Rotary or other custom geometries require a drawing and source-fit review.
Assembly: specify a standalone target or a target bonded to a backing plate, with the plate material, thickness, mounting features and bonding requirement.
Standard note: ASTM B708 applies to tantalum plate, sheet and strip feedstock. It is not a finished-target flatness or roughness specification; request those acceptance limits explicitly.
These existing target types have different chemistry from metallic tantalum. Select composition before comparing purity, geometry or bonding details.
Material: tantalum carbide (TaC), a compound target distinct from elemental Ta.
Specify composition, purity, geometry, backing needs and certificate requirements for the selected configuration. Review listed variants or send a drawing for a custom request.
Material: tantalum nitride (TaN), a compound target distinct from elemental Ta.
Specify composition, purity, geometry, backing needs and certificate requirements for the selected configuration. Review listed variants or send a drawing for a custom request. The example TaN certificate documents one batch, not every TaN target.
Material: tantalum pentoxide (Ta2O5), a compound target distinct from elemental Ta.
Specify composition, purity, geometry, backing needs and certificate requirements for the selected configuration. Review listed variants or send a drawing for a custom request.
Material: tantalum silicide (TaSi2), a compound target distinct from elemental Ta.
Specify composition, purity, geometry, backing needs and certificate requirements for the selected configuration. Review listed variants or send a drawing for a custom request.
Elemental Ta targets are used to deposit tantalum films by physical vapor deposition. Semiconductor thin-film development and research are common contexts, but film performance depends on the target specification, cathode, process and substrate. Tell us the intended film and process so the target configuration can be reviewed.
Choose the form that fits the sputtering source. Planar discs or rectangles require the cathode geometry and mounting details; a rotary target requires tube or assembly drawings and end-connection requirements. Utilization, cooling and deposition rate depend on the equipment and process, so they are not universal target performance guarantees.
Specify the film and sputtering conditions rather than selecting a target from application name alone. Metallic Ta and each tantalum compound can serve different coating goals.
For bonding and backing-plate options, see MetalsTek’s target bonding and backing-plate service. The suitable bond is reviewed for each target material and assembly.
Targets are identified and packed to protect the supplied surfaces during shipment. Include any clean handling, individual packaging, lot traceability or certificate requirements in the RFQ; the final packaging and inspection plan is confirmed for the order.
Use the purity and impurity limits required by your film or process specification. Existing catalog examples include 99.95% and 99.99% Ta; confirm the exact assay and lot certificate for the chosen configuration.
No. ASTM B708 covers tantalum and tantalum-alloy plate, sheet and strip. Give the finished target’s flatness, surface roughness and dimensional tolerance separately in your drawing or purchase specification.
Yes, bonding and backing-plate requirements can be reviewed. Send target and backing drawings, the cathode model, total thickness and any specified bonding method; suitability is confirmed for the assembly.
Send the target material and purity, dimensions or drawing, quantity, standalone or bonded construction, backing-plate details, inspection requirements and intended sputtering source. Enter “Tantalum Sputtering Target” in the Product / Material field below.
Review the tantalum product family, compare the broader sputtering target range, read the sputtering target selection guide, or discuss a complete assembly through target bonding and backing plates.
Provide the drawing or cathode model, Ta grade and impurity limits, target size, quantity, and any backing-plate or bonding requirements. Use the form on this page for engineering review and quotation.