metalstek-engineering-logo-white-color-full

Copper Foam Sponge

MetalsTek Engineering’s dedication to innovation ensures the continuous development and enhancement of its Copper Foam Sponge product line.

Copper Foam, Cu Foam

Copper Foam Sponge

Material: Copper, Cu

Shape: Sheet, Belt, or Customized

Size: Thickness 0.1~100mm * Width * Length

Porosity: ≥70%

Pore Size: 5~130ppi, 30~5,000um

Copper Foam Specifications

Compressive strength

131psi

Tensile strength

1,000psi

Shear strength

190psi

Vickers hardness

35

Specific heat

0.385J/g-°C

Melting point

1,080°C

Thermal expansion coefficient

1.7×10-5 m / m-°C (0-100°C)

Modulus of elasticity (tension)

14.6 × 103 psi

Nickel Copper Foam (Ni/Cu Foam)

Nickel Copper Foam

Material: Nickel Copper

Shape: Sheet, Belt, or Customized

Size: Thickness 1~30mm * Width * Length

Porosity: 50%~98%

Pore Size: 5~150ppi, or Customized

Description

Copper Foam Sponge, also known as metallic foam or copper foam, is a unique material characterized by its porous structure with interconnected voids and high surface area-to-volume ratio. This foam is produced by impregnating a metallic skeleton with a blowing agent and then heating it to remove the agent, resulting in a structure of metallic struts and pores. Copper foam exhibits remarkable properties such as high thermal conductivity, excellent electromagnetic shielding, and superior energy absorption capacity. Due to its lightweight nature and exceptional properties, copper foam finds applications in various industries ranging from aerospace and automotive to electronics and energy.

Applications of Copper Foam

Copper Foam can be used to prepare battery anode materials, catalyst carriers, and electromagnetic shielding materials. Copper Foam is used as the base material of the battery as the electrode, which has some obvious advantages, but the corrosion resistance of copper is not as good as that of nickel, which limits some of its applications.

  1. Heat Exchangers: Used in heat exchangers and thermal management systems for efficient heat dissipation in electronic devices, power modules, and HVAC systems.
  2. Electromagnetic Shielding: Employed in electronic enclosures, devices, and housings to prevent electromagnetic interference (EMI) and radio frequency interference (RFI).
  3. Catalyst Supports: Utilized as catalyst supports in chemical reactors and catalytic converters for improved reaction kinetics and efficiency.
  4. Energy Absorption: Used in impact-resistant materials, crash pads, and safety equipment to absorb and dissipate energy during collisions and impacts.
  5. Filtration: Employed in air and liquid filtration systems for trapping particulate matter, pollutants, and contaminants in industrial and environmental applications.
  6. Acoustic Insulation: Utilized as acoustic absorbers and soundproofing materials in architectural and automotive applications to reduce noise transmission.
  7. Thermal Insulation: Used as thermal insulators and heat shields in high-temperature environments such as furnaces, kilns, and spacecraft re-entry vehicles.
  8. Biomedical Applications: Employed in biomedical implants, tissue scaffolds, and drug delivery systems for its biocompatibility and porosity.
  9. Aerospace Components: Utilized in aircraft components, satellites, and spacecraft for lightweight structural components, thermal management, and vibration damping.

Packaging

Our Copper Foams are clearly labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

Request A Quote
Attach a Drawing
*Company e-mail address is preferred. 

Request A Quote
Attach a Drawing
*Company e-mail address is preferred. 

Request A Quote
Attach a Drawing
*e-mail address with your company's domain name is preferred.