Tungsten Micro-Electronic Filaments

Tungsten filaments are commonly used in high vacuum thin film deposition systems to heat substrates or crucibles containing the material to be deposited. The choice of filament shape and number of wires depends on the substrate’s area requirements and the characteristics of the material being heated.

Some key considerations when selecting a tungsten filament:

• Filament diameter: Thicker filaments can reach higher temperatures and are more robust, while thinner filaments are more flexible and can be coiled into smaller diameters.
• Number of wires: Single wire filaments are simple and inexpensive, while multi-wire filaments provide more uniform heating over a larger area.
• Filament shape: Coiled filaments are commonly used as they effectively increase the overall filament diameter, slowing evaporation and increasing lifetime. Straight filaments are simpler but may sag at high temperatures.
• Substrate size: The filament should be sized to match the substrate diameter. Larger substrates require longer filaments, while smaller substrates allow tighter coil diameters.
• Material properties: The filament must be able to reach the required temperature to evaporate or melt the source material. Tungsten is ideal due to its high melting point and low vapor pressure at high temperatures.

In summary, choosing the right tungsten filament involves balancing factors like cost, size, heating uniformity and lifetime to match the specific requirements of the deposition process and substrate. Consulting with the filament manufacturer can help select the optimal configuration.

MetalsTek has rich experience in customizing micron-electronic filaments, with short lead times and competitive pricing.