Copper Evaporation Materials

MetalsTek Engineering is a worldwide leading manufacturer and supplier of high-purity Copper Evaporation Materials. Our range of products includes copper metals, as well as their alloys, compounds, and other related offerings. The most common evaporation materials shapes are pellets, granules, rod, wire, and starter sources. However, if you need an uncommon shape or size, contact us to see if we can meet your specific requirements.

Copper Evaporation Materials, Cu

Copper Evaporation Materials, Cu

Materials: Copper

Purity: 99.9%~99.9999%

Properties: 1,083°C M.P., 8.92 g/cc Density

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Oxide Evaporation Material, CuO

Copper Oxide Evaporation Material, CuO

Materials: Copper Oxide

Purity: 99.9%~99.99%

Properties: 1,201°C M.P., 6.31 g/cc Density

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Applications
  • Semiconductor films for electronic devices
  • Gas sensors for environmental monitoring
  • Optoelectronic devices, such as solar cells and LEDs
  • Research and development in advanced materials
  • Catalysis and surface modification

Copper Aluminum Evaporation Materials, Cu/Al Al/Cu

Copper Aluminum Evaporation Materials

Materials: Copper Aluminum Alloy

Purity: 99.9%~99.999%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Applications
  • Semiconductor manufacturing
  • Optical coatings
  • Thin film resistors
  • Surface engineering
  • Decorative coatings
  • Heat sink applications
  • Magnetic recording media
  • Aerospace and aviation
  • Energy storage

Copper Chromium Evaporation Materials, Cu/Cr Cr/Cu

Copper Chromium Evaporation Materials

Materials: Copper Chromium Alloy

Purity: 99.9%~99.999%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Cobalt Evaporation Materials, Cu/Co Co/Cu

Copper Cobalt Evaporation Materials

Materials: Copper Cobalt Alloy

Purity: 99.9%~99.999%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Nickel Evaporation Materials, Cu/Ni Ni/Cu

Copper Nickel Evaporation Materials

Materials: Copper Nickel Alloy

Purity: 99.9%~99.999%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Zinc Evaporation Materials, Cu/Zn Zn/Cu

Copper Zinc Evaporation Materials

Materials: Copper Zinc Alloy

Purity: 99.9%~99.999%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Indium Evaporation Material, Cu/In

Copper Indium Evaporation Material

Materials: Copper Indium Alloy

Purity: 99.9%~99.999%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Gallium Evaporation Material, Cu/Ga

Copper Gallium Evaporation Material

Materials: Copper Galliu Alloy

Purity: 99.9%~99.999%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Germanium Evaporation Material, Cu/Ge

Copper Germanium Evaporation Material

Materials: Copper Germanium Alloy

Purity: 99.9%~99.999%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Manganese Copper Evaporation Material, Mn/Cu

Manganese Copper Evaporation Material

Materials: Manganese Copper Alloy

Purity: 99.9%~99.99%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Aluminum Silicon Copper Evaporation Materials, Al/Si/Cu

Aluminum Silicon Copper Evaporation Materials

Materials: Aluminum Silicon Copper Alloy

Purity: 99.9%~99.99%

Compositions: Can be Customized

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Sulfide Evaporation Material, CuS

Copper Sulfide Evaporation Material, CuS

Materials: Copper Sulfide

Purity: 99.9%~99.95%

Properties: Black Solid, 500°C M.P., 4.76g/cc Density

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Selenide Evaporation Materials, CuSe

Copper Selenide Evaporation Materials, CuSe

Materials: Copper Selenide

Purity: 99.9%~99.999%

Properties: Black Solid, 550°C M.P., 5.99g/cc Density

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Indium Selenide Evaporation Material, CIS

Copper Indium Selenide Evaporation Material, CIS

Materials: Copper Indium Selenide

Purity: 99.9%~99.999%

Properties: Solid, 1,327°C M.P., 5.77g/cc Density

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Copper Indium Gallium Selenide Evaporation Material, CIGS

Copper Indium Gallium Selenide Evaporation Material, CIGS

Materials: Copper Indium Gallium Selenide

Symbol: CuIn1−xGaxSe2 (x = 0~1)

Purity: 99.9%~99.999%

Properties: Silvery, 990~1,070°C M.P., ≈5.7g/cc Density

Form: Powder, Granules, Pieces, Customized

Size: 1~6mm, or Tailored Sizes

Description

Copper (Cu) and its alloys are cornerstone materials in the domain of vacuum evaporation, offering unmatched electrical and thermal conductivity, pivotal to produce electronic, optical, and coating layers. These materials, particularly favored for their efficacy in creating conductive paths, are instrumental in the manufacturing of electronic circuits, semiconductor devices, and solar panels. The adaptability of copper, available in forms such as pellets, granules, and powders, ensures its compatibility with diverse vacuum evaporation setups, catering to a broad spectrum of industrial applications. Copper has a melting point of 1,083°C, a density of 8.92 g/cc, and is a top-quality conductor of heat and electricity.

Expanding beyond elemental copper, copper-based evaporation materials, including various alloys and compounds like copper oxides (CuO and Cu2O), enrich the application landscape. These derivatives not only inherit copper’s excellent conductivity but also introduce properties like enhanced corrosion resistance, mechanical strength, and specific optical characteristics. This versatility makes copper-based materials essential for a wide array of applications, from functional coatings in electronics to decorative finishes in architectural elements, showcasing their critical role in advancing material science and thin film technology.

Copper (Cu) Specifications

Material Type

Copper

Coefficient of Thermal Expansion

16.5 x 10-6/K

Symbol

Cu

Theoretical Density

8.92 g/cc

Atomic Weight

63.546

Z Ratio

0.437

Atomic #

29

Sputter

DC

Appearance

Copper, Metallic

Max Power Density

200 (Watts/Square Inch)

Thermal Conductivity

400 W/m.K

Type of Bond

Indium, Elastomer

Melting Point

1083°C

Comments

Adhesion poor. Use interlayer (Cr). Evaporates using any source material.

Applications

The applications of Copper Evaporation Material include:

  1. Semiconductor Manufacturing: Used as a deposition material for thin film deposition in semiconductor devices such as integrated circuits and microprocessors.
  2. Optical Coatings: Employed in the production of optical coatings for lenses, mirrors, and filters in various optical devices like cameras and telescopes.
  3. Decorative Coatings: Utilized in decorative coatings for consumer electronics, automotive parts, and architectural applications to provide aesthetic appeal and corrosion resistance.
  4. Printed Circuit Boards (PCBs): Applied in the production of PCBs for electrical conductivity and surface finishing to improve solderability and solder joint reliability.
  5. Heat Sink Applications: Used as a coating material on heat sinks and thermal management components to enhance heat dissipation in electronic devices and LED lighting.
  6. Electrical Contacts: Employed in electrical contacts and connectors for its excellent electrical conductivity and corrosion resistance.
  7. Magnetic Recording Media: Utilized as a magnetic recording layer in magnetic storage devices such as hard disk drives for data storage and retrieval.
  8. Metallization: Applied in metallization processes for metallizing surfaces of plastics, ceramics, and glass to improve adhesion and conductivity.
  9. Surface Modification: Used for surface modification in various industries, including automotive, aerospace, and medical, to enhance surface properties such as hardness and wear resistance.

Packaging

Our Copper Evaporation Materials are clearly labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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