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Material: Gold, Au
Purity: Au 99.99%
Form: Pieces, Pellets, Powder, or Customized
Sizes: Pellets – Dia.2×2mm, Dia.3×3mm, Dia.6×6mm; Pieces <4mm; Powders
Other: Form and Size Can be Customized
Gold is a highly versatile and lustrous noble metal that has played a significant role throughout history and continues to be essential in modern applications. It has a melting point of 1,064°C, a density of 19.32 g/cm³, and exhibits low vapor pressure, making it well-suited for high-temperature and vacuum environments. Gold’s properties extend beyond its aesthetic appeal, offering exceptional ductility and malleability, which allow it to be processed into fine structures, thin films, and precision components.
Gold also provides excellent electrical conductivity and outstanding resistance to oxidation and corrosion, making it a critical material in high-reliability industries. It is widely used in electronics, connectors, bonding materials, and advanced microelectronic devices. In addition to jewelry and decorative applications, gold metal is utilized in various forms such as pellets, powders, and pieces for thin film deposition, semiconductor fabrication, sensors, fuel cells, and optical coatings.
Its stability, conductivity, and adaptability make gold an indispensable material across industries such as electronics, aerospace, medical technology, and energy systems, highlighting its continued importance in both traditional and advanced manufacturing processes.
Gold metal is available in various forms such as pellets, pieces, and powders, with tightly controlled purity and physical properties to meet the demands of thin film deposition, electronics, and high-performance applications.
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Material | Gold (Au) | Ensures excellent conductivity and chemical stability |
| Purity | 99.9% – 99.999% (3N–5N+) | Higher purity improves deposition quality and device reliability |
| Form | Pellets, Pieces, Powder | Suitable for evaporation, sputtering, and research use |
| Pellet Size | Dia. 2×2 mm, 3×3 mm, 6×6 mm | Compatible with standard evaporation sources |
| Piece Size | < 4 mm | Flexible for various crucible loading needs |
| Powder Size | Micron / Nano (customizable) | Controls evaporation rate and film uniformity |
| Density | 19.32 g/cm³ | Ensures material consistency |
| Melting Point | 1,064°C | Suitable for high-temperature processes |
| Electrical Conductivity | ~70% IACS | Critical for electronic and conductive applications |
| Vapor Pressure | 10⁻⁴ Torr @ ~1,300°C | Important for vacuum deposition performance |
| Surface Condition | Clean, Oxide-Free | Ensures high-quality thin films |
| Packaging | Vacuum-Sealed / Inert Gas Packed | Prevents contamination during transport |
Gold metal is widely used across advanced industries due to its excellent electrical conductivity, outstanding corrosion resistance, and superior chemical stability. Its reliability in demanding environments makes it an essential material for both industrial and research applications.