MetalsTek Engineering is a leading manufacturer and supplier of high-purity Gold Powder, suitable for applications in thin-film deposition, electronics, catalysis, and advanced research.

Material: Gold, Au
Purity: Au 99.99%
Form: Powder, or Customized
Sizes: Micron or Nano scale (customizable particle size distribution)
Other: Particle size, purity, and morphology (spherical / irregular) can be customized
Gold powder is a highly versatile and lustrous noble metal material that plays an essential role in both traditional applications and modern advanced technologies. Gold has a melting point of 1,064°C and a density of 19.32 g/cm³, along with low vapor pressure, making it suitable for high-temperature and vacuum environments. Its properties extend beyond visual appeal, offering excellent chemical stability, corrosion resistance, and outstanding workability.
Gold powder provides good electrical conductivity and exceptional resistance to oxidation, making it a valuable material in electronics, conductive pastes, and precision components. Due to its fine particle size and high surface area, it is widely used in catalysis, nanotechnology, and advanced material research. Gold powder is also utilized in thin film deposition processes, where it can be evaporated under vacuum conditions to produce semiconductors, sensors, fuel cells, and optical coatings.
In addition to industrial uses, gold powder is applied in jewelry, decorative coatings, and specialized coatings requiring high purity and stability. Its combination of conductivity, chemical inertness, and adaptability makes gold powder indispensable in industries such as electronics, medical technology, energy systems, and advanced manufacturing.
Gold powder is manufactured with precise control over purity, particle size, and morphology to meet the requirements of electronics, catalysis, thin film deposition, and advanced material applications. Both micron and nano-scale powders are available for different performance needs.
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Material | Gold (Au) | Ensures excellent conductivity and chemical stability |
| Purity | 99.9% – 99.999% (3N–5N+) | Higher purity improves performance in electronics and research |
| Particle Size | 20 nm – 50 µm (customizable) | Controls surface area, reactivity, and application suitability |
| Morphology | Spherical / Irregular / Flake | Affects packing density, flowability, and conductivity |
| Specific Surface Area | Customizable | Critical for catalysis and nano applications |
| Density (Bulk/Tap) | Application-dependent | Influences processing and compaction behavior |
| Melting Point | 1,064°C | Suitable for high-temperature processes |
| Electrical Conductivity | High (~70% IACS) | Important for conductive pastes and electronics |
| Surface Condition | Clean, Oxide-Free | Ensures stable performance and high-quality deposition |
| Flowability | Controlled | Important for powder handling and manufacturing processes |
| Packaging | Vacuum-Sealed / Inert Gas Packed | Prevents contamination and oxidation |
Gold powder is widely used in advanced industries due to its excellent chemical stability, high conductivity, and unique surface properties. Its versatility in both micron and nano scales makes it suitable for a broad range of high-performance applications.
We take great care in handling our gold powder to prevent any potential damage during storage and transportation. Through strict quality control and protective packaging measures, we ensure that each product maintains its original purity, particle size distribution, and surface condition. This careful approach guarantees that our gold powder arrives in pristine condition, ready for optimal performance in demanding applications.