MetalsTek Engineering specializes in manufacturing up to 99.999% purity Tin Evaporation Materials with high quality for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.
Material: Tin
Purity: 99.9%~99.999%
Form: Pellets, Powder, Granule, or Customized
Size: 2~6mm Pellets, Can be Customized
Applications: Semiconductor Deposition, CVD, PVD, Optics Coatings
Material: Antimony Doped Tin Oxide
Purity: SnO2:Sb 99.9%~99.99%
Properties: 6.9g/cc Density, ≈1,720°C M.P.
Form: Pellets, Powder, Granule, or Customized
Size: 2~6mm Pellets, Can be Customized
Applications: Solar Cells, Displays, Smart Windows
Material: Tin Zinc, Composition Customized
Purity: 99.9%~99.999%
Form: Pellets, Powder, Granule, or Customized
Size: 2~6mm Pellets, Can be Customized
Applications: Semiconductor Deposition, CVD, PVD, Optics Coatings
Material: Tin Oxide
Purity: 99.9%~99.999%
Properties: Light Yellow, 6.95g/cc Density, ≈1,630°C M.P.
Form: Pellets, Powder, Granule, or Customized
Size: 2~6mm Pellets, Can be Customized
Material: Tin Sulfide
Purity: 99.9%
Properties: Yellow, 4.5g/cc Density, ≈600°C M.P.
Form: Powder, Granule, or Customized
Material: Tin Fluoride
Purity: 99.9%
Properties: 4.57g/cc Density, ≈213°C M.P.
Form: Powder, Granule, or Customized
Applications: Wear Protection, Decorative, Displays, Optical Coatings
Tin evaporation materials are utilized in thin-film deposition processes, offering advantages such as good adhesion, corrosion resistance, and electrical conductivity. These materials are commonly used in applications like semiconductor manufacturing, optical coatings, and electronics. Tin-based evaporation materials, which may include alloys like Zinc Tin (Zn/Sn), provide a sophisticated solution for thin-film deposition processes by combining the beneficial properties of tin with other elements. The versatility of tin and tin-based evaporation materials makes them essential components in industries ranging from electronics to aerospace, where precise thin-film coatings are required for optimal performance and functionality.
Material Type | Tin | E-Beam | Excellent |
Symbol | Sn | Thermal Evaporation Techniques | Boat: Mo |
Atomic Weight | 118.71 | Coil: W | |
Atomic Number | 50 | Basket: W | |
Appearance | Silvery Lustrous Gray, Metallic | Crucible: Al2O3 | |
Thermal Conductivity | 66.6 W/m.K | E-Beam Crucible Liner Material | FABMATE®, Tantalum |
Melting Point | 232 °C | Temp. (°C) for Given Vap. Press. (Torr) | 10-8: 682 |
Coefficient of Thermal Expansion | 22 x 10-6/K | 10-6: 807 | |
Theoretical Density | 7.28 g/cc | 10-4: 997 | |
Z Ratio | 0.724 | Comments | Wets Mo low sputter power. Use Ta liner in E-beam guns. Low Melting Point materials not ideal for sputtering. |
Tin Evaporation Materials are utilized in various industries for their unique properties and applications:
Our Tin and Tin-based Evaporation Materials are clearly labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.