metalstek-engineering-logo-white-color-full
  • Tel | (213) 373-5225
  • Email | sales@metalstek.com
metalstek-engineering-logo-white-color-full
GET A QUOTE
metalstek-engineering-logo-white-color-full
GET A QUOTE

Elastomer Target Bonding Service

Elastomer Target Bonding is a specialized process used primarily in the semiconductor and materials deposition industries. This method involves attaching a sputtering target to a backing plate using an elastomeric material. The process ensures optimal thermal and electrical conductivity while providing flexibility and durability under varying operational conditions. 

Elastomer target bonding utilizes an elastomer, a polymer with elastic properties, to bond the target material to a backing plate. The elastomer acts as an adhesive layer that can absorb mechanical stresses, accommodate thermal expansion differences, and maintain the integrity of the bond during the sputtering process.

Elastomer Target Bonding Specifications

Maximum Operating Temperature (°C)250 ° C
Thermal Conductivity (W/mK)54
Coefficient of Thermal Expansion (K-1)2.2 x 10-4
Electrical Resistivity (ohm-cm)0.0476
Bond Coverage>98%
Bond Line Thickness0.010” ~ 0.025”

Benefits of Elastomer Bonding Sputtering Targets

  1. Thermal Management: The elastomer layer provides excellent thermal conductivity, ensuring efficient heat dissipation during sputtering, which helps maintain target performance and longevity. Elastomer bonds can withstand higher temperatures, making them suitable for applications where indium bonds fail.
  2. Stress Absorption: The elastomer’s elastic nature helps absorb mechanical stresses and vibrations, reducing the risk of target cracking or delamination.
  3. Flexibility: It accommodates thermal expansion differences between the target and the backing plate, preventing deformation and maintaining a stable bond.
  4. Durability: The robust bond created by the elastomer withstands repeated thermal cycling, ensuring long-term reliability.
  5. Gentle Bonding Process: The bonding process occurs at relatively low temperatures, between 50°C and 100°C, minimizing stress on the target during bonding.
  6. UHV Compatibility: Despite concerns about polymer-based materials outgassing in a vacuum chamber, the elastomer bond is Ultra-High Vacuum (UHV) compatible and has a NASA “A” rating. It undergoes less than a 1% total mass change at 150°C at 1 x 10-7 Torr for 24 hours.
  7. Moisture Resistance: The elastomer does not absorb moisture, making it suitable for handling cycles between vacuum and atmosphere.

Applications of Elastomer Bonding Sputtering Targets

  1. Elastomer target bonding is widely used in various applications, including:

    • Semiconductor Manufacturing: For the deposition of thin films in semiconductor devices.
    • Optical Coatings: In the production of lenses, mirrors, and other optical components.
    • Data Storage: For the deposition of magnetic and protective layers in hard disk drives.
    • Decorative Coatings: In applications requiring durable and aesthetically pleasing surface finishes.

Process of Elastomer Bonding Sputtering Targets

    • Preparation: Both the target and the backing plate surfaces are thoroughly cleaned and prepared to ensure optimal adhesion.
    • Application of Elastomer: A layer of elastomer is applied to either the target or the backing plate.
    • Bonding: The target is placed onto the backing plate, and pressure is applied to ensure a uniform bond.
    • Curing: The bonded assembly is subjected to a controlled curing process to solidify the elastomer and complete the bonding.
Request A Quote
Attach a Drawing
*Company e-mail address is preferred.